Manufacture of printed circuit boards :
41 products
COMPACTPCI PASSIVE PC•MIP MODULE CARRIER CM5-TRIO
CompactPCI Passive PC•MIP Module Carrier
Three Mezzanine Modules Fitting on a 3U Eurocard
Because the customer can profit from both individual configuration of the system and moderate cost,
mezzanine concepts are very popular for industrial grade computers. Based on the PC•MIP module standard, EKF presents the CM5-TRIO, a 3U CompactPCI ® passive carrier board for PC•MIP modules.
The PC•MIP electrical characteristics are derived from the PCI specification. Compared to PMC modules, PC•MIP allows for higher system integration due to its considerable smaller dimensions. A 3U form factor Eurocard carrier board can hold up to three PC•MIP modules.
The CM5-TRIO is provided with the popular PCI bridge chip Intel/DEC 21150. All 3 PC•MIP slots are connected to the local PCI bus. Access to any individual PC•MIP module by the host CPU takes place transparently across the PCI bridge.
2 of the PC•MIP slots are suitable for Type-II modules with front panel orientated I/O. The remaining slot can be used with a Type-I module only.
EKF already offers a variety of I/O functions as PC•MIP Type-II module, e.g. Ethernet, USB, ISDN and IEEE-1394 (FireWire).
Please note that the CM5-TRIO does not provide rear I/O across the PC•MIP modules J3 on any of the three PC•MIP slots. This is in order to avoid potential conflicts with a 64-bit CompactPCI backplane.
For volume quantities however, EKF would like to offer a customer specific version of the CM5-TRIO using the J2/P2 CPCI connector as rear I/O path to a transition module.
Ordering Information
Alias Ordering No. Short Description
TRIO CM5-1-TRIO PC•MIP Carrier Board, 3U, 3-slots, passive
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EKF Elektronik
M3D PRINTABLE ELECTRONICS
The M3D system is a fast, flexible tool that can produce miniaturized electronic circuitry and components, without the need for the masks, patterns and chemicals that are common to screen-printing
processes.
The system can directly deposit a wide range of commercial and custom electronic materials, including conductor, insulator and adhesive formulations onto virtually any substrate. Support of nanomaterials allows for low-temperature processing and ultra-thin layers where needed. The resulting functional circuits can have line widths and pattern features from below 10 microns to greater than 100 microns.
The M3D system integrates well within the current electronics manufacturing landscape based on both functional and economic advantages. While costly thin-film methods used for semiconductor production are optimized for sub-micron features, and screen-printing processes used for PWB and component production have difficulty getting below 100 microns, the M3D system bridges the gap that exists between these traditional technologies.
Printed Circuit BoardsM3D addresses the need for miniaturization of the circuit boards that serve as the backbone of all electronics products. While mainstream screen-printing methods are hard pressed to produce traces below 100 microns, M3D can fabricate high-density circuitry in materials such as copper, silver and gold with line widths down to 10 microns and smaller. In addition to "direct write" of conductive traces, the M3D system can be used to deposit a full range of electronics materials, including insulators, adhesives, and even intermediary materials such as photo-resist or seed layers for copper plating.
Embedded Passives and Components Current screen-printing techniques are not an effective solution for embedded passives because they require laser trimming, and multiple screening operations are required to produce widely varying resistor values on a single layer.
M3D provides a compelling alternative for EPC production since it can directly manufacture high tolerance passives with a wide range of resistance values in a single layer. The solution can also be used to "embed" other components, such as capacitors, filters, antennae, etc., and can further be used for producing the trace interconnects within a layer. Finally, the additive nature of M3D means that it can be utilized in conjunction with existing methods to add high-value passives or as a tool to repair passives that do not meet specification.
Flex CircuitsM3D is ideal for the production of circuits on flexible substrates since the process operates at extremely low temperatures. In such applications, M3D has demonstrated excellent adhesion to the substrate, sufficient to withstand the stresses of dynamic flexing.
Hybrid Manufacturing for Electronic DevicesNext Generation devices such as fuel cells, flat panel displays, and MEMS often require multi-layer multi-material manufacturing techniques. With its additive approach, an M3D system can be a valuable contributor to such multi-step manufacturing processes, both as a development and prototyping tool, and as a production solution. M3D demonstrations in this area include sub-micron layers of platinum for fuel cells, high-density back planes (organic and metal) for flat panel displays, and deposition of photo-resist for MEMS production. Additionally, M3D systems are being used to repair production defects on flat panel displays.
Semiconductor PackagingM3D capabilities further provide for reductions in the size of electronic systems by enabling a range of High Density Interconnect applications such as chip-scale packaging, flip-chip packaging and even direct die attach right to the substrate which would eliminate the need for discrete packaging. Other emerging semiconductor level applications include System-on-Chip and System-in-Package.
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Optomec
FOTOBOARD 2
FOTOBOARD2 is a high quality pre-sensitised laminate, ideal for producing small numbers of printed circuit boards (PCBs) for use by design engineers or for work in the classroom or laboratory. Its
key benefits are that it enables the manufacturing process to be fast and consistent - for both single and double sided boards.
All materials used in the manufacture of FOTOBOARD2 are high quality. This, together with our technical expertise and stringent manufacturing controls, ensures the high standard of every product which is delivered to our customer.
FOTOBOARD2 is coated with a positive working photo resist which is inherently capable of reducing defects caused by dust and dirt on the photowork and printing frame. The unexposed photo resist remains hard after exposure to form the image or circuit pattern and remains unaffected by the developing process.
The unexposed resist is a blue/green In colour and when exposed, tends to go a shade lighter - the change can be seen in daylight.
To ensure a uniform coating thickness, we have incorporated a roller coating system in our production line. This gives more stability, particularly in the final processes, and consistency from batch to batch.
The board's final coat is a low tack black film which affords mechanical and light protection.
FOTOBOARD2 Specification
Two basic substrates are used in the manufacture of FOTOBOARD2. FR4 and CEM/1 are both rigid composite laminates - standard thickness 1/16" (1.6mm) n/n, 1/0, 1/1, copper. Others available at request.
FR 4 is a material composed of class woven glass cloth and copper foil. It is flame retardant according to UL-94 grade V-O
The laminate meets most commonly used specifications and is tested according to NEMA, LI-1 : MIL-P-13949 and IEC249-2-5.
Thickness tolerances to MIL-P-13949H Glass II and IEC 249-2-5 (TAB II)
Copper surface aspect to MIL-P-13949H
Copper foil to IEC 249-3 Type A electrodeposited copper foils
Copper thickness to IEC 249-3A class I (TABIII) Up to a maximum thickness of 3.2mm can be supplied on request.
CEM/1 is a material composed of a paper--based core impregnated with epoxy resin, glass woven face sheets impregnated with epoxy resin and copper foil. Like FR 4, it is flame retardant according to UL-94 grade V-O and meets most commonly used specifications. It is tested according to NEMA, LI-1: IEC249-2-9.
Thickness tolerances to IEC 249-2-9 (TAB I). Copper surface aspect to MIL-P-13949G.
Copper foil to IEC 249-3.
Copper thickness to IEC 249-3A class I (TABII) Up to a maximum thickness of 3.2mm can be supplied on request
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PRECISION MICRO LTD
COMPACTPCI PC•MIP - CD1-OPERA
Feature Summary CD1-OPERA
Form Factor Double size CompactPCI style Eurocard (160x233mm2), front panel width 4HP (20.3mm)
Processor Intel® Mobile Pentium® Processor 4 - M (Northwood® 0.13u
generation), 400MHz PSB, 512KB second level cache, clock rate 1.7GHz (1.3V/30W), 2.2GHz (1.3V/35W)
Chipset i845G(V) (Brookdale®) chipset consisting of:
82845G(V) Graphics/Memory Controller Hub (GMCH)
82801D I/O Controller Hub (ICH4)
2 x Firmware Hub (FWH) 82802 compatible
Memory 200-pin SO-DIMM socket (notebook style module), PC2100 DDR266-SDRAM, 1GB maximum capacity
Video I/O Analog monitor and digital flat-panel display support by DVI-I connector (front panel), up to 2048 x 1536 pixel 16M colours 85Hz refresh rate, incorporates PanelLink Digital technology (Silicon Image)
USB I/O Type A connector (front panel) USB 2.0, another two USB ports across rear I/O (J4)
Ethernet I/O 3 independent 10/100/1000Mbps Gigabit Ethernet controllers, 82540 chip, 2 x RJ-45 connectors available from the front panel, 1 x rear I/O according to PICMG® 2.16 across J3
Legacy I/O LPC Super-I/O controller on-board, COM1 (front panel), combined PS/2 keyboard and mouse port (front panel), COM2, parallel port, floppy disk interface (rear I/O across J4)
IDE/ATA Ultra ATA/100 44-pin connector (secondary IDE, master/slave)
CompactFlash socket for CFA ATA cards (secondary IDE, master)
Primary IDE port available across rear I/O (J4)
Primary IDE port optionally available for an on-board 2.5-inch hard disk mezzanine module (CD1-4-OPERA)
PXI Interface PCI eXtensions for Instrumentation Standard, Rev. 2.0 (rear I/O across J2)
Mezzanine I/O Stuffed alternatively:
1 slot for a PMC module, I/O from the front panel and across J5 (e.g. CD1-1-OPERA)
2 slots for PC•MIP modules, I/O from front panel and across J5 (e.g. CD1-2-OPERA)
On-board 2.5" hard disk module (primary IDE)
Rear I/O transition board available (CDX-RIO)
Rear I/O IDE, Floppy, USB2, USB3, LPT, COM2, GPIO (J4)
Gigabit Ethernet (J3)
Mezzanine Rear I/O (J5)
Rear I/O transition module available (CDX-RIO)
CompactPCI Bus 64-bit, 33/66MHz, PCI bridge HINT HB6 (PLX), configurable as CompactPCI system slot controller (e.g. CD1-1-OPERA), or peripheral slot board (e.g. CD1-A-OPERA)
Hot Swap Function Board installing and removing without adversely effecting a running system, 'Full Hot Swap' implementation according to CompactPCI Hot Swap Specification PICMG® 2.1 (for peripheral slot boards only, e.g. CD1-A-OPERA)
BIOS Phoenix BIOS 4.0 Rel.6.0, 8/16Mbit Flash (Dual Firmware Hub)
MTBF 88,000h
Ambient Temperature 0°C bis +60°C (Operation)
-40°C bis +85°C (Storage)
Relative Humidity 5% to 95% (non condensing)
Altitude -300m to +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
Typical Calculating Performance PCMark2002 under Windows 2000, CPU/MEM Score:
4132/3931 @1.7GHz, 5236/4152 @2.2GHz
Ordering Information
Alias Ordering No. Short Description
OPERA CD1-1-OPERA 6U CPCI CPU card, 1.7GHz Mobile Northwood P4, 512MB DDR SDRAM, 3 x USB, 2 x Gigabit Ethernet, 1 x PICMG® 2.16 Backplane Ethernet, Ultra ATA/100 IDE, CompactFlash ATA slot, DVI-I video out, KBD/mouse, COM1/2, floppy, 1 x PMC mezzanine slot, CompactPCI system controller
OPERA CD1-2-OPERA Similar to CD1-1-OPERA, 2 x PC-MIP mezzanine slots
OPERA CD1-3-OPERA Similar to CD1-1-OPERA, w/o PICMG® 2.16 Backplane Ethernet (J3 not stuffed)
OPERA CD1-4-OPERA Similar to CD1-1-OPERA, with 2.5-inch hard disk mezzanine module
OPERA CD1-A-OPERA Similar to CD1-1-OPERA, but configured as CompactPCI peripheral board (slave CPU), suitable for multi-processing applications
OPERA CD1-B-OPERA Similar to CD1-2-OPERA, but configured as CompactPCI peripheral board (slave CPU), suitable for multi-processing applications
CD1-P22-OPERA 2.2GHz processor option
CD1-Z-OPERA 1GB memory option
RIO CDX-1-RIO
6U, 4HP J4/J5 rear I/O transition module
RIO CDX-2-RIO
6U, 8HP J4/J5 rear I/O transition module with rear I/O 2.5" hard disk module
RACK CR7-1-RACK
19-" Rack 7U, 8 slots CompactPCI 6U backplane P1-P5 (rear I/O P3-P5), power supply, floppy disk, hard disk, DVD-ROM
RACK CR7-9-RACK
Option desktop case 7U
TIGER DE2-2-TIGER
PMC module, SATA controller + 1.8-inch hard disk drive
280.7.400 External PS/2 keyboard/mouse Y-splitter-cable mini-DIN male to 2 x mini-DIN female
908.51.02.01 DVI-D to DVI-D cable assembly, 2m, connects the CD1-OPERA to DVI monitors (digital way)
908.57.02.01 DVI-I to HD DSUB15 cable assembly, 2m, connects the CD1-OPERA to VGA monitors (analog way)
908.57.12.01 DVI-I to VGA adapter (plug to receptacle), to be plugged onto the CD1-OPERA DVI output, with HD DSUB15 socket, suitable especially for analog monitors with attached VGA cable
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EKF Elektronik
