Applied Precision

United Kingdom

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With 3-D Probe Tip Analysis In an industry where success is measured in months, you need every advantage when introducing new processes and maintaining current ones. Advantages like knowing how efficiently your probing station is performing, the key areas of inefficiency in the probing process and where to focus your efforts at improvement. The waferWoRx 300 is the only tool that enables you to rapidly assess your probing process, identify and analyze issues within the process, and define solution options. By thoroughly analyzing the probe marks from tested or

unpatterned wafers, the true performance of the prober, probe card, and analyzer is revealed; as a unit and individually. This information is paramount for maintaining or improving current processes. In the development and implementation of new processes, detailed knowledge of your test cell's performance can make all the difference in your time to yield. The waferWoRx 300 system provides data on 23 parameters assessing the position, size and angle of the probe mark and whether the subsequent pad damage affects optimal wire bonding. Our proprietary, advanced software can determine additional parameters including prober stage accuracy, prober set-up errors and probe card performance. The software graphically reports on the accuracy and repeatability of the test process for each of these parameters based on user-defined pass/fail criteria.
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